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Reduced Latency DRAM (RLDRAM) is a type of specialty dynamic random-access memory (DRAM) with a SRAM-like interface originally developed by Infineon Technologies.It is a high-bandwidth, semi-commodity, moderately low-latency (relative to contemporaneous SRAMs) memory targeted at embedded applications (such as computer networking equipment) requiring memories that have moderate costs and low ...
ARINC 818 (Avionics Digital Video Bus) is a point-to-point, 8b/10b-encoded (or 64B/66B for higher speeds) serial protocol for transmission of video, audio, and data. The protocol is packetized but is video-centric and very flexible, supporting an array of complex video functions including the multiplexing of multiple video streams on a single link or the transmission of a single stream over a ...
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs [1] and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers ...
Network-intensive applications like networked storage or cluster computing need a network infrastructure with a high bandwidth and low latency. The advantages of RDMA over other network application programming interfaces such as Berkeley sockets are lower latency, lower CPU load and higher bandwidth. [6]
O3b mPOWER is a communications satellite system owned and operated by SES.The system uses high-throughput and low-latency satellites in a medium Earth orbit (MEO), along with ground infrastructure and intelligent software, to provide multiple terabits of global broadband connectivity for applications including cellular backhaul and international IP trunking, cruise line connectivity, disaster ...
Thus, DDR2 memory must be operated at twice the data rate to achieve the same latency. Another cost of the increased bandwidth is the requirement that the chips are packaged in a more expensive and difficult to assemble BGA package as compared to the TSSOP package of the previous memory generations such as DDR SDRAM and SDR SDRAM. This ...
It is a bidirectional serial/parallel high-bandwidth, low-latency point-to-point link that was introduced on April 2, 2001. [1] The HyperTransport Consortium is in charge of promoting and developing HyperTransport technology.
IEEE 802.15.4-2003 (Low Rate WPAN) deals with low data rate but very long battery life (months or even years) and very low complexity. The standard defines both the physical (Layer 1) and data-link (Layer 2) layers of the OSI model. The first edition of the 802.15.4 standard was released in May 2003.