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A multi-surface cooler is a sub-type of passive cooler. It allows airflow both between the laptop base and cooler, and between the base of the cooler and the user's lap. These laptop coolers are suitable for laptops that have vents on the underside. The multi-surface cooling design typically works on any surface without blocking any vents.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
Hot swapping is the replacement or addition of components to a computer system without stopping, shutting down, or rebooting the system; [1] hot plugging describes the addition of components only. [2] Components which have such functionality are said to be hot-swappable or hot-pluggable; likewise, components which do not are cold-swappable or ...
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
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In an EE380 talk, [31] [32] an Asus engineer mentioned that the Eee PC uses the keyboard shielding as a heat sink to absorb the heat generated by the processor. Three chips need heatsinking, and this is achieved by heat-conductive adhesive pads which sit between the chip heatsink flats and the keyboard shield and connect them thermally.