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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...
For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit ...
Soldering (US: / ˈ s ɒ d ər ɪ ŋ /; UK: / ˈ s oʊ l d ər ɪ ŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.
Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle size. [ 4 ] Some suppliers use proprietary particle size descriptions, Henkel/Loctite descriptions are given for comparison.
In informal usage, the term "printed circuit board" most commonly means "printed circuit assembly" (with components). The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly".
Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board.
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