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Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. [ 1 ]
The etch chemistry is dispensed on the top side when in the machine and the bottom side is not affected. This etching method is particularly effective just before "backend" processing , where wafers are normally very much thinner after wafer backgrinding, and very sensitive to thermal or mechanical stress. Etching a thin layer of even a few ...
Electropolishing, also known as electrochemical polishing, anodic polishing, or electrolytic polishing (especially in the metallography field), is an electrochemical process that removes material from a metallic workpiece, reducing the surface roughness by levelling micro-peaks and valleys, improving the surface finish.
Polishing lines will be soft and less reflective than a #4 architectural finish. #7 Finish. A #7 finish is produced by polishing with a 280–320 grit belt or wheel and sisal buffing with a cut and color compound. This is a semi-bright finish that will still have some polishing lines but they will be very dull.
Chemical-mechanical polishing, which is used in semiconductor fabrication; Fabrication and testing of optical components; Flame polishing, a type of polishing used on glass and thermoplastics; Ultra-fine, abrasive paste polishing, polishing for soft or fragile work surfaces; Vapor polishing, a method of polishing plastics to optical clarity
While used less extensively than traditional mechanical polishing, electropolishing is an alternative form of polishing that uses the principles of electrochemistry to remove microscopic layers of metal from a base surface. [3] This method of polishing can be fine-tuned to give a wide range of finishes, from matte to mirror-bright.
Electrochemical machining, as a technological method, originated from the process of electrolytic polishing offered already in 1911 by a Russian chemist E. Shpitalsky. [3] As far back as 1929, an experimental ECM process was developed by W.Gussef, although it was 1959 before a commercial process was established by the Anocut Engineering Company.
Densifying solutions also seal the floor from problems like rebar expansion, mildew, and mold. Once the floor is hard enough, the next step is honing. This process is needed to refine the hardened surface using finer abrasives (e.g. 200- to 400-grit resin). After honing, the next step is polishing. Here, the floor is polished with much finer ...