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  2. Static random-access memory - Wikipedia

    en.wikipedia.org/wiki/Static_random-access_memory

    A six-transistor (6T) CMOS SRAM cell. WL: word line. BL: bit line. A typical SRAM cell is made up of six MOSFETs, and is often called a 6T SRAM cell. Each bit in the cell is stored on four transistors (M1, M2, M3, M4) that form two cross-coupled inverters. This storage cell has two stable states which are used to denote 0 and 1.

  3. File:SRAM Cell (6 Transistors).svg - Wikipedia

    en.wikipedia.org/wiki/File:SRAM_Cell_(6...

    I, the copyright holder of this work, release this work into the public domain. This applies worldwide. This applies worldwide. In some countries this may not be legally possible; if so:

  4. Mobile phone accessories - Wikipedia

    en.wikipedia.org/wiki/Mobile_phone_accessories

    Mobile phone chargers have gone through a diverse evolution that has included cradles, plug-in cords and obscure connectors. However, devices built between 2010 and 2020 generally use micro-USB connectors, while newer devices tend to use USB-C.

  5. 6T - Wikipedia

    en.wikipedia.org/wiki/6t

    6T SRAM (for 6 transistors); see 1T-SRAM; RDS-6t Truba warhead; see Joe 4; Ye-6T, one of the 1958 Mikoyan-Gurevich MiG-21 variants; 2-8-6T locomotive; see 2-8-6; PRC-6T walkie-talkie; see AN/PRC-6; 6T, the production code for the 1985 Doctor Who serial Attack of the Cybermen; OnePlus 6T, an Android-based smartphone manufactured by OnePlus

  6. Content-addressable memory - Wikipedia

    en.wikipedia.org/wiki/Content-addressable_memory

    CMOS Ternary CAM cell consisting of two 6T SRAM cells plus 4 comparison transistors. Normally opposite logic levels, either '0' and '1' or '1' and '0' will be stored in the two cells. For a don't care condition '0' will be stored in both cells so that the match line ML will not be pulled low for any combination of search line (SL) data.

  7. 1T-SRAM - Wikipedia

    en.wikipedia.org/wiki/1T-SRAM

    1T-SRAM has speed comparable to 6T-SRAM (at multi-megabit densities). It is significantly faster speed than eDRAM, and the "quad-density" variant is only slightly larger (10–15% is claimed). On most foundry processes, designs with eDRAM require additional (and costly) masks and processing steps, offsetting the cost of a larger 1T-SRAM die.

  8. Random-access memory - Wikipedia

    en.wikipedia.org/wiki/Random-access_memory

    In SRAM, the memory cell is a type of flip-flop circuit, usually implemented using FETs. This means that SRAM requires very low power when not being accessed, but it is expensive and has low storage density. A second type, DRAM, is based around a capacitor. Charging and discharging this capacitor can store a "1" or a "0" in the cell.

  9. 7 nm process - Wikipedia

    en.wikipedia.org/wiki/7_nm_process

    The Contacted Poly Pitch (CPP) would have been 56nm and the Minimum Metal Pitch (MMP) would have been 40nm, produced with Self-Aligned Double Patterning (SADP). A 6T SRAM cell would have been 0.269 square microns in size. GlobalFoundries planned to eventually use EUV lithography in an improved process called 7LP+. [99]

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