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  2. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab with a hole used to mount the component to a heat sink. Thermal compound is often applied between package and heatsink to further improve heat transfer.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  4. Talk:TO-220 - Wikipedia

    en.wikipedia.org/wiki/Talk:TO-220

    Vishay Semiconductor have released 20W resistors in TO-220 form. so this indicates the expected heat dissipation of the package with a heatsink. source: "TPR Thick Film Technology 20 Watt Power Resistors TO-220 Package". there are 50W zeners in TO-3, and 10W in DO-4, 100W in DO-5 (for comparison). Charlieb000 21:22, 3 August 2012 (UTC)

  5. Thermal conductance and resistance - Wikipedia

    en.wikipedia.org/wiki/Thermal_conductance_and...

    The SI unit of absolute thermal resistance is kelvins per watt (K/W) or the equivalent degrees Celsius per watt (°C/W) – the two are the same since the intervals are equal: ΔT = 1 K = 1 °C. The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled.

  6. Multi-leaded power package - Wikipedia

    en.wikipedia.org/wiki/Multi-leaded_power_package

    Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply ...

  7. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

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