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  2. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab with a hole used to mount the component to a heat sink. Thermal compound is often applied between package and heatsink to further improve heat transfer.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  4. Talk:TO-220 - Wikipedia

    en.wikipedia.org/wiki/Talk:TO-220

    Vishay Semiconductor have released 20W resistors in TO-220 form. so this indicates the expected heat dissipation of the package with a heatsink. source: "TPR Thick Film Technology 20 Watt Power Resistors TO-220 Package". there are 50W zeners in TO-3, and 10W in DO-4, 100W in DO-5 (for comparison). Charlieb000 21:22, 3 August 2012 (UTC)

  5. Thermal conductance and resistance - Wikipedia

    en.wikipedia.org/wiki/Thermal_conductance_and...

    The SI unit of absolute thermal resistance is kelvins per watt (K/W) or the equivalent degrees Celsius per watt (°C/W) – the two are the same since the intervals are equal: ΔT = 1 K = 1 °C. The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled.

  6. Multi-leaded power package - Wikipedia

    en.wikipedia.org/wiki/Multi-leaded_power_package

    Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply ...

  7. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    This cools the heat sink and whatever it is in direct thermal contact with. Use of fluids (for example coolants in refrigeration) and thermal interface material (in cooling electronic devices) ensures good transfer of thermal energy to the heat sink. Similarly, a fan may improve the transfer of thermal energy from the heat sink to the air.

  8. Joule heating - Wikipedia

    en.wikipedia.org/wiki/Joule_heating

    The efficiency by which electricity is converted to heat depends upon on salt, water, and fat content due to their thermal conductivity and resistance factors. [13] In particulate foods, the particles heat up faster than the liquid matrix due to higher resistance to electricity and matching conductivity can contribute to uniform heating. [11]

  9. Power MOSFET - Wikipedia

    en.wikipedia.org/wiki/Power_MOSFET

    NXP 7030AL - N-channel TrenchMOS logic level FET IRF640 Power Mosfet die. The power MOSFET is the most widely used power semiconductor device in the world. [3] As of 2010, the power MOSFET accounts for 53% of the power transistor market, ahead of the insulated-gate bipolar transistor (27%), RF power amplifier (11%) and bipolar junction transistor (9%). [24]