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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
The SI unit of absolute thermal resistance is kelvins per watt (K/W) or the equivalent degrees Celsius per watt (°C/W) – the two are the same since the intervals are equal: ΔT = 1 K = 1 °C. The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
The Biot number is the ratio of the thermal resistance for conduction inside a body to the resistance for convection at the surface of the body. This ratio indicates whether the temperature inside a body varies significantly in space when the body is heated or cooled over time by a heat flux at its surface.
Dimensionless numbers (or characteristic numbers) have an important role in analyzing the behavior of fluids and their flow as well as in other transport phenomena. [1] They include the Reynolds and the Mach numbers, which describe as ratios the relative magnitude of fluid and physical system characteristics, such as density, viscosity, speed of sound, and flow speed.
Standard heat pipes are constant conductance devices, where the heat pipe operating temperature is set by the source and sink temperatures, the thermal resistances from the source to the heat pipe, and the thermal resistances from the heat pipe to the sink. In these heat pipes, the temperature drops linearly as the power or condenser ...
In thermodynamics, the source and sinks correspond to two types of thermal reservoirs, where energy is supplied or extracted, such as heat flux sources or heat sinks. In thermal conduction this is described by the heat equation. [10] The terms are also used in non-equilibrium thermodynamics by introducing the idea of sources and sinks of ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).