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  2. DipTrace - Wikipedia

    en.wikipedia.org/wiki/DipTrace

    DipTrace is a proprietary software suite for electronic design automation (EDA) used for electronic schematic capture and printed circuit board layouts. DipTrace has four applications: schematic editor, PCB editor with built-in shape-based autorouter and 3D preview, component editor (schematic symbol), and pattern editor (PCB footprint).

  3. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    This results in an inseparable one piece product. For example, a four-layer PCB can be fabricated by starting from a two-sided copper-clad laminate, etch the circuitry on both sides, then laminate to the top and bottom pre-preg and copper foil. It is then drilled, plated, and etched again to get traces on top and bottom layers. [41]

  4. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    A double-layer of silicon nitride and phosphosilicate glass (PSG) film was used as an intermediate insulating layer between the top and bottom devices. This provided the basis for realizing a multi-layered 3D device composed of vertically stacked transistors, with separate gates and an insulating layer in between. [ 53 ]

  5. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    The gray and green layers are nonconducting, while the thin orange layers and red vias are conductive. A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the ...

  6. Routing (electronic design automation) - Wikipedia

    en.wikipedia.org/wiki/Routing_(electronic_design...

    In electronic design, wire routing, commonly called simply routing, is a step in the design of printed circuit boards (PCBs) and integrated circuits (ICs). It builds on a preceding step, called placement, which determines the location of each active element of an IC or component on a PCB.

  7. Package on a package - Wikipedia

    en.wikipedia.org/wiki/Package_on_a_package

    In April 2007, Toshiba commercialized an eight-layer 3D chip package, the 16 GB THGAM embedded NAND flash memory chip, which was manufactured with eight stacked 2 GB NAND flash chips. [8] The same month, U.S. patent 7,923,830 ("Package-on-package secure module having anti-tamper mesh in the substrate of the upper package") was filed by Steven M ...

  8. ODB++ - Wikipedia

    en.wikipedia.org/wiki/ODB++

    ODB++ can handle all the specifications surrounding a PCB – i.e. not only the basic dimensions and the layout of conducting layers and drill data, but optionally also material stack up, netlist with test points, component bill of materials, component placement and fabrication data.

  9. EAGLE (program) - Wikipedia

    en.wikipedia.org/wiki/Eagle_(program)

    EAGLE is a scriptable electronic design automation (EDA) application with schematic capture, printed circuit board (PCB) layout, auto-router and computer-aided manufacturing (CAM) features. EAGLE stands for Easily Applicable Graphical Layout Editor ( German : Einfach Anzuwendender Grafischer Layout-Editor ) and is developed by CadSoft Computer ...

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