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  2. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.

  3. Via fence - Wikipedia

    en.wikipedia.org/wiki/Via_fence

    Via hole equivalent circuit. The design of the fence needs to consider the size and spacing of the vias. Ideally, vias should act as short circuits, but they are not ideal and a via equivalent circuit can be modelled as a shunt inductance. Sometimes, a more complex model is required such as the equivalent circuit shown in figure 4.

  4. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    Initially PCBs were designed manually by creating a photomask on a clear mylar sheet, usually at two or four times the true size. Starting from the schematic diagram the component pin pads were laid out on the mylar and then traces were routed to connect the pads. Rub-on dry transfers of common component footprints increased efficiency. Traces ...

  5. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.

  6. File:Via hole equivalent circuit.svg - Wikipedia

    en.wikipedia.org/wiki/File:Via_hole_equivalent...

    You are free: to share – to copy, distribute and transmit the work; to remix – to adapt the work; Under the following conditions: attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses ...

  7. Through-silicon via - Wikipedia

    en.wikipedia.org/wiki/Through-silicon_via

    In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.

  8. Substrate-integrated waveguide - Wikipedia

    en.wikipedia.org/wiki/Substrate-integrated_waveguide

    A substrate-integrated waveguide (SIW) (also known as post-wall waveguide or laminated waveguide) is a synthetic rectangular electromagnetic waveguide formed in a dielectric substrate by densely arraying metallized posts or via holes that connect the upper and lower metal plates of the substrate.

  9. JST connector - Wikipedia

    en.wikipedia.org/wiki/JST_connector

    Download as PDF; Printable version; ... Wire size Shroud Lock Notes Datasheet VH [5] 3.96 ... JST PH 2-pin right-angle through-hole PCB.

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