Search results
Results from the WOW.Com Content Network
IBM has a semiconductor wafer reclamation process that uses a specialized pattern removal technique to repurpose scrap semiconductor wafers to a form used to manufacture silicon-based solar panels. The new process was recently awarded the “2007 Most Valuable Pollution Prevention Award” from The National Pollution Prevention Roundtable (NPPR).
Wafers grown using materials other than silicon will have different thicknesses than a silicon wafer of the same diameter. Wafer thickness is determined by the mechanical strength of the material used; the wafer must be thick enough to support its own weight without cracking during handling. The tabulated thicknesses relate to when that process ...
This is a list of silicon producers. The industry involves several very different stages of production. Production starts at silicon metal, which is the material used to gain high purity silicon. High purity silicon in different grades of purity is used for growing silicon ingots, which are sliced to wafers in a process called wafering.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .
The use of polycrystalline silicon in the production of solar cells requires less material and therefore provides higher profits and increased manufacturing throughput. Polycrystalline silicon does not need to be deposited on a silicon wafer to form a solar cell, rather it can be deposited on other, cheaper materials, thus reducing the cost.
Computer monitors are typically packed into low stacks on wooden pallets for recycling and then shrink-wrapped. [1]Electronic waste recycling, electronics recycling, or e-waste recycling is the disassembly and separation of components and raw materials of waste electronics; when referring to specific types of e-waste, the terms like computer recycling or mobile phone recycling may be used.
The optional second step (for bare silicon wafers) is a short immersion in a 1:100 or 1:50 solution of aqueous HF (hydrofluoric acid) at 25 °C for about fifteen seconds, in order to remove the thin oxide layer and some fraction of ionic contaminants. If this step is performed without ultra high purity materials and ultra clean containers, it ...
Silicon wafer with mirror finish. Most elemental silicon produced remains as a ferrosilicon alloy, and only approximately 20% is refined to metallurgical grade purity (a total of 1.3–1.5 million metric tons/year). An estimated 15% of the world production of metallurgical grade silicon is further refined to semiconductor purity. [79]