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A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
The wall casting belonging to this circuit is shown in figure 3. [5] Figure 4. Via hole equivalent circuit. The design of the fence needs to consider the size and spacing of the vias. Ideally, vias should act as short circuits, but they are not ideal and a via equivalent circuit can be modelled as a shunt inductance.
Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
Through-hole (leaded) resistors Through-hole devices mounted on the circuit board of a mid-1980s Commodore 64 home computer A box of drill bits used for making holes in printed circuit boards. While tungsten-carbide bits are very hard, they eventually wear out or break. Drilling is a considerable part of the cost of a through-hole printed ...
It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or ...
The ANOVA results showed that the strain concentration factor was the most important variable, followed with the ductility factor, metallization thickness, and via wall angle. Prabhu et al. [ 10 ] conducted a finite element analysis (FEA) on an HDI microvia structure to determine the effect of accelerated temperature cycling and thermal shock.
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
Profiling is, for example, used a lot in sensor fabrication, where a circuit needs to fit round tubes or other different complex shapes. Drilling of holes can provide a "via" (conductive link) between the two sides of the substrate, normally hole sizes are in the range 0.15–0.2 mm.
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