Search results
Results from the WOW.Com Content Network
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
Surface-mount components on a USB flash drive's circuit board. The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) ferrite bead.
Original file (SVG file, nominally 279 × 306 pixels, file size: ... List of electronic component packaging types; Surface-mount technology; User talk:Zerodamage;
To produce a quality solder joint, it's very important for the spheres of metal to be very regular in size and have a low level of oxidation [citation needed]. Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle ...
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device package with metal end terminals. Diodes and resistors are the most common MELF devices. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]
M7 general purpose diode in DO-214AC (SMA) package (surface mount version of 1N4007) [1] DO-214 is a standard that specifies a group of semiconductor packages for surface-mounted diodes . Overview
A thin-shrink small-outline package (TSSOP) is a rectangular, thin-body component. A TSSOP's leg count can range from 8 to 64. A TSSOP's leg count can range from 8 to 64. TSSOPs are particularly suited for gate drivers, controllers, wireless / RF , op-amps , logic , analog , ASICs , memory ( EPROM , E2PROM ), comparators and optoelectronics .
Size comparison of BJT transistor packages, from left to right: SOT-23, TO-92, TO-126, TO-3 3D model of TO-3 package. In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits.