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Schematic diagram of an opto-isolator showing source of light (LED) on the left, dielectric barrier in the center, and sensor (phototransistor) on the right [note 1]. An opto-isolator (also called an optocoupler, photocoupler, or optical isolator) is an electronic component that transfers electrical signals between two isolated circuits by using light. [1]
English: A diagram of a simple circuit using an optocoupler. When the switch S' 1 is closed, the diode emits light and the transistor conducts. v' out thus goes low. This circuit therefore acts much like a logicalNOT gate.
ASME Y14.44-2008 [1] and IEEE 315-1975 [2] define how to reference and annotate components of electronic devices. It breaks down a system into units, and then any number of sub-assemblies. The unit is the highest level of demarcation in a system and is always a numeral.
Optocoupler schematic diagram. Own work. File usage. No pages on the English Wikipedia use this file (pages on other projects are not listed). Global file usage.
IC power-supply pins are voltage and current supply terminals found on integrated circuits (ICs) in electrical engineering, electronic engineering, and integrated circuit design. [ a ] ICs have at least two pins that connect to the power rails of the circuit in which they are installed.
[2] For an NPN open emitter output, the collector is connected to the positive voltage rail, so the emitter outputs a high voltage when the transistor is on and is hi-Z when off. For a PNP open emitter output, the collector is connected to the low voltage supply, so the emitter outputs a low voltage when the transistor is on and is hi-Z when off.
Engineer using an early IC-designing workstation to analyze a section of a circuit design cut on rubylith, circa 1979. Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.