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Ryzen 3 Pro 3200GE: Sep 30, 2019: Ryzen 3 3200G: 3.6 4.0 1250 1280 65 W Jul 7, 2019: US $99 [85] Ryzen 3 Pro 3200G: Sep 30, 2019: OEM Ryzen 5 Pro 3350GE: 3.3 3.9 Radeon Graphics 640:40:16 10 CU 1200 1536 35 W Jul 21, 2020: Ryzen 5 Pro 3350G: 4 (8) 3.6 4.0 1300 1830.4 65 W Ryzen 5 3400GE: 3.3 Vega 11 704:44:16 11 CU 35 W Jul 7, 2019: Ryzen 5 Pro ...
The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture.The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores.
It integrates a built-in AI accelerator (branded as "Ryzen AI") for the first time in an x86 processor, [81] and features RDNA 3 integrated graphics with up to 12 compute units. The Ryzen 7045 series is the top of the range, based on Zen 4.
Zen 3 with 3D V-Cache was officially previewed on May 31, 2021. [33] It differs from Zen 3 in that it includes 3D-stacked L3 cache on top of the normal L3 cache in the CCD, providing a total of 96 MB. The first product that uses it, the Ryzen 7 5800X3D, was released on April 20, 2022. The added cache brings an approximately 15% performance ...
An AMD Ryzen 5 2600 Die shot of a Ryzen 3 1200. Zen series CPUs and APUs (released 2017) Summit Ridge Ryzen 1000 series (desktop)
As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit and 3D integrated graphics processing unit (IGPU) on a single die.
RDNA 3 uses two types of chiplets: the Graphics Compute Die (GCD) and Memory Cache Dies (MCDs). On Ryzen and Epyc processors, AMD used its PCIe-based Infinity Fabric protocol with the package's dies connected via traces on an organic substrate.
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