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Additionally, TSMC and Samsung's 10 nm processes are only slightly denser than Intel's 14 nm in transistor density. They are actually much closer to Intel's 14 nm process than they are to Intel's 10 nm process (e.g. Samsung's 10 nm processes' fin pitch is the exact same as that of Intel's 14 nm process: 42 nm).
In 2012, the X-Fab group acquired MEMS foundry Itzehoe GmbH where the latter was a spin-off from Fraunhofer Institute for Silicon Technology (ISIT). Nevertheless, X-Fab continues its cooperation with ISIT in the chip business. [9] [10] X-Fab also expanded its MEMS manufacturing capabilities. The foundry in Itzehoe became fully owned by X-Fab in ...
MEMS design & process development, Lab-to-Fab approach. Focus areas include photonics, microfluidics, watch components, and harsh environments. Lithium niobate and silicon carbide processing are notable technology bricks. Silicon, SOI, lithium niobate, silicon carbide, fused silica, quartz, glass. Prototyping, small & medium volume production 6
A key fob is a generally decorative and at times useful item many people often carry with their keys, on a ring or a chain, for ease of tactile identification, to provide a better grip, or to make a personal statement. Key fob can also specifically refer to modern electronic car keys, or smart keys, which serve as both a key and remote.
Brush electroplating has several advantages over tank plating, including portability, the ability to plate items that for some reason cannot be tank plated (one application was the plating of portions of very large decorative support columns in a building restoration), low or no masking requirements, and comparatively low plating solution ...
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
The process uses an abrasive and corrosive chemical slurry (commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the wafer. The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring.
In electrowinning, an electrical current is passed from an inert anode through a leach solution containing the dissolved metal ions so that the metal is recovered as it is reduced and deposited in an electroplating process onto the cathode. In electrorefining, the anode consists of the impure metal (e.g., copper) to be refined. The impure ...
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