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A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
General-purpose computing on graphics processing units (GPGPU, or less often GPGP) is the use of a graphics processing unit (GPU), which typically handles computation only for computer graphics, to perform computation in applications traditionally handled by the central processing unit (CPU).
The fluid medium is frequently air, but can also be water, refrigerants, or even oil. If the fluid medium is water, the heat sink is frequently called a cold plate. In thermodynamics a heat sink is a heat reservoir that can absorb an arbitrary amount of heat without significantly changing temperature. Practical heat sinks for electronic devices ...
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
TechPowerUp GPU-Z (or just GPU-Z) is a lightweight utility designed to provide information about video cards and GPUs. [2] The program displays the specifications of Graphics Processing Unit (often shortened to GPU) and its memory; also displays temperature, core frequency, memory frequency, GPU load and fan speeds.
Components of a GPU. A graphics processing unit (GPU) is a specialized electronic circuit initially designed for digital image processing and to accelerate computer graphics, being present either as a discrete video card or embedded on motherboards, mobile phones, personal computers, workstations, and game consoles.
Charge injection, where hot carriers generated by avalanche breakdown are injected into the oxide layer. Catastrophic ESD failure modes include: Junction burnout, where a conductive path forms through the junction and shorts it; Metallisation burnout, where melting or vaporizing of a part of the metal interconnect interrupts it
Both Intel and Advanced Micro Devices (AMD) have defined TDP as the maximum heat generation for thermally significant periods, while running worst-case non-synthetic workloads; thus, TDP is not reflecting the actual maximum power of the processor. This ensures the computer will be able to handle essentially all applications without exceeding ...