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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  3. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Heat sinks function by efficiently transferring thermal energy ("heat") from an object at high temperature to a second object at a lower temperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the first object into thermal equilibrium with the second, lowering the temperature of the first object ...

  4. Processor power dissipation - Wikipedia

    en.wikipedia.org/wiki/Processor_power_dissipation

    When the CPU is idle, it will draw far less than the typical thermal power. Datasheets normally contain the thermal design power (TDP), which is the maximum amount of heat generated by the CPU, which the cooling system in a computer is required to dissipate.

  5. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:

  6. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  7. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  8. Air cooling - Wikipedia

    en.wikipedia.org/wiki/Air_cooling

    A Cooler Master computer heat sink has many heat pipes. CPU cooler Thermalright Le Grand Macho RT installed into the computer case. Air cooling is a method of dissipating heat. It works by expanding the surface area or increasing the flow of air over the object to be cooled, or both.

  9. Junction temperature - Wikipedia

    en.wikipedia.org/wiki/Junction_temperature

    This in turn is used to select an appropriate heat sink if applicable. Other cooling methods include thermoelectric cooling and coolants . In modern processors from manufacturer such as Intel , AMD , Qualcomm , the core temperature is measured by a network of sensors.