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The Surface Laptop 3 is the 3rd addition to Surface Laptop lineup. The Surface Laptop 3 is aimed toward business professionals and the enterprise market. [10] The device is available with either a 13.5-inch or 15-inch display touchscreen. The device features a full-body aluminum alloy construction alongside an Alcantara material on the keyboard ...
The laptop was announced at the #MicrosoftEDU event by Microsoft on 2 May 2017, [1] alongside Windows 10 S and an updated version of Surface Arc Mouse that includes a large capacitive surface. [ 2 ] [ 3 ] It became available for pre-order on the same day, and began shipping on 15 June 2017.
Most laptops have two memory slots, although some will have only one, either for cost savings or because some amount of memory is soldered. Some high-end models have four slots; these are usually mobile engineering workstations, although a few high-end models intended for gaming do as well.
Some models, such as the 1000H and 904HD, do not have a SSD, and instead have a SATA internal hard drive of either 80 or 160 GB, which can be upgraded by the user. All Eee PC models also include a memory card reader, supporting SD, SDHC and MMC cards for additional storage, while the Eee PC S101 also has support for Memorystick and MS-PRO .
The 13-inch gained an integrated Nvidia GeForce 320M graphics chip with 256 MB of shared memory, while the 15- and 17-inch models were upgraded to the GeForce GT 330M, with either 256 or 512 MB of dedicated memory. [41] The 15- and 17-inch models also have an integrated Intel GPU that is built into the Core i5 and i7 processors. [41]
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
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Other memory technologies – namely HBM in version 3 and 4 [58] – aiming to replace DDR4 have also been proposed. In 2011, JEDEC introduced the Wide I/O 2 standard, which features stacked memory dies placed directly on top of the CPU within the same package. This configuration provides higher bandwidth and improved power efficiency compared ...
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