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CTBGA: thin chip array ball grid array; CVBGA: very thin chip array ball grid array; DSBGA: die-size ball grid array; FBGA: fine ball grid array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs; also known as fine pitch ball grid array (JEDEC-Standard [9]) or fine line BGA by Altera.
Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory.Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
Organic ball-grid array [3] TFBGA: Thin fine-pitch ball-grid array [3] PBGA: Plastic ball-grid array [3] MAP-BGA: Mold array process - ball-grid array : UCSP: Micro (μ) chip-scale package: Similar to a BGA (A Maxim trademark example) [17] μBGA: Micro ball-grid array: Ball spacing less than 1 mm LFBGA: Low-profile fine-pitch ball-grid array [3 ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...
Not long after, the plastic ball grid array (BGA), another type of area array package, became one of the most commonly used packaging techniques. [ 7 ] In the late 1990s, plastic quad flat pack (PQFP) and thin small-outline packages (TSOP) replaced PGA packages as the most common for high pin count devices, [ 1 ] though PGA packages are still ...
Ball grid arrays (BGA) and chip scale packages (CSA) present special difficulties for testing and rework, as they have many small, closely spaced pads on their underside which are connected to matching pads on the PCB. Connecting pins are not accessible from the top for testing, and cannot be desoldered without heating the whole device to the ...
Embedded instrumentation can perform design validation, test and debug routines that external validation and test technologies cannot. An example of this would be Intel's IBIST technology which can stress and thereby test high-speed I/O buses well beyond the capabilities of traditional testing techniques that are applied through an operating ...