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A 16GB [1] DDR4 SO-DIMM module by Micron. DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm ...
40/48 GB — DDR4 3200 MHz (8/16 GB soldered, 1 slot) Intel UHD (i3-1315U) or Intel Iris Xe. Optional NVIDIA GeForce MX550 (2 GB GDDR6) One M.2 2242 3.0 x4 + One M.2 2242 4.0 x4 Gigabit Ethernet Wi-Fi 6 / Wi-Fi 6E + BT 5.1 (soldered) NO WWAN M.2 Card: 1920 × 1200 IPS 300 nits 1920 × 1200 IPS 300 nits Touch 2560 × 1600 IPS 400 nits: m 47Wh ...
1 GB PC3200 non-ECC modules are usually made with 16 512 Mbit chips, 8 on each side (512 Mbits × 16 chips) / (8 bits (per byte)) = 1,024 MB. The individual chips making up a 1 GB memory module are usually organized as 2 26 8-bit words, commonly expressed as 64M×8. Memory manufactured in this way is low-density RAM and is usually compatible ...
Data is accessed in bursts of either 16 or 32 transfers (256 or 512 bits, 32 or 64 bytes, 8 or 16 cycles DDR). Bursts must begin on 64-bit boundaries. Since the clock frequency is higher and the minimum burst length longer than earlier standards, control signals can be more highly multiplexed without the command/address bus becoming a bottleneck.
While similar to the 9310, the 9305 includes an additional USB-C port (3 in total) and utilizes an earlier generation chassis (XPS 13 9370) with a narrower keyboard (2019 era). The 9305 is intended to be a lower cost model; the screen only comes in 1080p resolution and the maximum hard drive and memory sizes are 512 GB and 16 GB respectively. [46]
Native support for dual-channel DDR3/DDR3L memory, [24] with up to 32 GB of RAM on LGA 1150 variants 64 KB (32 KB Instruction + 32 KB Data) L1 cache and 256 KB L2 cache per core [ 25 ] A total of 16 PCI Express 3.0 lanes on LGA 1150 variants [ 26 ]
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