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Drypoint is a printmaking technique of the intaglio family, in which an image is incised into a plate (or "matrix") with a hard-pointed "needle" of sharp metal or diamond point. In principle, the method is practically identical to engraving .
Dry etching is used in conjunction with photolithographic techniques to attack certain areas of a semiconductor surface in order to form recesses in material.. Applications include contact holes (which are contacts to the underlying semiconductor substrate), via holes (which are holes that are formed to provide an interconnect path between conductive layers in the layered semiconductor device ...
Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.
A reactive-ion etching setup in a laboratory cleanroom. Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers.
Even in the exquisite engravings after J. M. W. Turner, which reached a degree of delicacy in light and shade far surpassing the work of the old masters, the engravers had recourse to etching, finishing with the burin and dry point. Considered as important an influence upon engraving as Raphael and Rubens, Turner contributed much to the field ...
Temperature can be increased to raise the etching rate. Continuous stirring of the solution during the etching process helps to have a more homogeneous solution, which may etch more uniformly by removing etched material from the surface. Buffered oxide etch can be used in the metallographic etching of titanium alloys.
In etching, a liquid ("wet") or plasma ("dry") chemical agent removes the uppermost layer of the substrate in the areas that are not protected by photoresist. In semiconductor fabrication , dry etching techniques are generally used, as they can be made anisotropic , in order to avoid significant undercutting of the photoresist pattern.
Like surface micromachining, bulk micromachining can be performed with wet or dry etches, although the most common etch in silicon is the anisotropic wet etch. This etch takes advantage of the fact that silicon has a crystal structure, which means its atoms are all arranged periodically in lines and planes. Certain planes have weaker bonds and ...