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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
The Raspberry Pi 5 uses a 64-bit 2.4 GHz quad-core ARM Cortex-A76 processor. The Raspberry Pi 5 uses the Broadcom BCM2712 SoC, which is a chip designed in collaboration with Raspberry Pi. The SoC features a quad-core ARM Cortex-A76 processor clocked at 2.4 GHz, alongside a VideoCore VII GPU clocked at 800 MHz.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
The Raspberry Pi 4 is the 4th generation of the mainline series of Raspberry Pi single-board computers.Developed by Raspberry Pi (Trading) Ltd [1] and released on 24 June 2019, the Pi 4 came with many improvements over its predecessor; the SoC was upgraded to the Broadcom BCM2711, two of the Raspberry Pi's four USB ports were upgraded to USB 3.0, and options were added for RAM capacities ...
Raspberry Pi OS is a Unix-like operating system based on the Debian Linux distribution for the Raspberry Pi family of compact single-board computers. Raspbian was developed independently in 2012, became the primary operating system for these boards since 2013, was originally optimized for the Raspberry Pi 1 and distributed by the Raspberry Pi Foundation. [3]
TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab with a hole used to mount the component to a heat sink. Thermal compound is often applied between package and heatsink to further improve heat transfer.
In an EE380 talk, [31] [32] an Asus engineer mentioned that the Eee PC uses the keyboard shielding as a heat sink to absorb the heat generated by the processor. Three chips need heatsinking, and this is achieved by heat-conductive adhesive pads which sit between the chip heatsink flats and the keyboard shield and connect them thermally.
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