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  2. Ceramic tile cutter - Wikipedia

    en.wikipedia.org/wiki/Ceramic_tile_cutter

    A tile saw with a water-cooled diamond blade in use. Dedicated tile saws are designed to be used with water as a coolant for the diamond blade. They are available in different sizes. Adjustable fences for angled cuts and square cuts. Fence stops for multiple cuts of exactly the same size.

  3. Disc cutter - Wikipedia

    en.wikipedia.org/wiki/Disc_cutter

    Some discs used for cutting ceramic tile or stone are made from a solid disc with an edge coated with diamond grit. The most common size for these cutting wheels is 4 + 1 ⁄ 2 inches in diameter; however they can range from 2 to 16 inches in diameter with a thickness range from .045 in. to .125 in. Type 1 discs are flat, and type 27 discs have ...

  4. Diagonal pliers - Wikipedia

    en.wikipedia.org/wiki/Diagonal_pliers

    Diagonal pliers (also known as wire cutters or diagonal cutting pliers, or under many regional names) are pliers intended for the cutting of wire or small stock, rather than grabbing or turning. The plane defined by the cutting edges of the jaws intersects the joint rivet at an angle or "on a diagonal", giving pliers their name.

  5. Diamond tool - Wikipedia

    en.wikipedia.org/wiki/Diamond_tool

    The cutting edge of most diamond tools is sharp to tens of nanometers, making it very effective for cutting non-ferrous materials with high resolution. SPDT is a very accurate machining process, used to create finished aspherical and irregular optics without the need for further polishing after completion.

  6. Diamond cutter - Wikipedia

    en.wikipedia.org/?title=Diamond_cutter&redirect=no

    Retrieved from "https://en.wikipedia.org/w/index.php?title=Diamond_cutter&oldid=424775488"This page was last edited on 19 April 2011, at 00:22 (UTC). (UTC).

  7. Dicing saw - Wikipedia

    en.wikipedia.org/wiki/Dicing_saw

    Diamond wire saw in stone industry. A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire [1] to dice, cut, or groove semiconductor wafers, and glass, ceramic, crystal, and many other types of material.

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