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A drawing of a ZN414 IC in a TO-18 package. MELF: Metal electrode leadless face (usually for resistors and diodes) SOD: Small-outline diode. SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323). TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. TO-3: Panel-mount with leads
Cost is a factor in selection of integrated circuit packaging. Typically, an inexpensive plastic package can dissipate heat up to 2W, which is sufficient for many simple applications, though a similar ceramic package can dissipate up to 50W in the same scenario. [1] As the chips inside the package get smaller and faster, they also tend to get ...
Type Road number Build year Total produced AAR wheel arrangement Prime mover Power output Image EMC 1800 hp B-B: ATSF 1: 1935 1 B-B+B-B: Dual Winton 12-201-A: 1,800 hp (1,342 kW)
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Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are proprietary ...
Chaz Lanier scored 29 points to lead No. 1 Tennessee over No. 23 Arkansas 76-52 on Saturday and tie for the best start to a season in program history. The Volunteers (14-0, 1-0 Southeastern ...
OG Maco, the Atlanta rapper best known for his 2014 hit “U Guessed It,” died at the age of 32. The musician, born Benedict Chiajulam Ihesiba Jr., was admitted to a Los Angeles hospital on Dec ...
Some parts may be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures. In the design of electronic products, electronic packaging engineers perform analyses to estimate such things as maximum temperatures for components, structural resonant frequencies, and dynamic stresses and deflections under worst ...