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  2. Nickel electroplating - Wikipedia

    en.wikipedia.org/wiki/Nickel_electroplating

    The cathode efficiency depends on the process and varies between 90 and 97%. Due to this mismatch, during the plating the nickel concentration in the solution and the pH will slowly rise. [6] The process takes minutes to hours depending on the current density and the intended thickness of the plating. [7]

  3. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    The main ingredients of an electroless nickel plating bath are source of nickel cations Ni 2+, usually nickel sulfate and a suitable reducing agent, such as hypophosphite H 2 PO − 2 or borohydride BH − 4. [1] With hypophosphite, the main reaction that produces the nickel plating yields orthophosphite H 2 PO − 3, elemental phosphorus ...

  4. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    It measures useable current density range, optimization of additive concentration, recognition of impurity effects, and indication of macro throwing power capability. [14] The Hull cell replicates the plating bath on a lab scale. It is filled with a sample of the plating solution and an appropriate anode which is connected to a rectifier. The ...

  5. Current density - Wikipedia

    en.wikipedia.org/wiki/Current_density

    In electromagnetism, current density is the amount of charge per unit time that flows through a unit area of a chosen cross section. [1] The current density vector is defined as a vector whose magnitude is the electric current per cross-sectional area at a given point in space, its direction being that of the motion of the positive charges at this point.

  6. Skin effect - Wikipedia

    en.wikipedia.org/wiki/Skin_effect

    Regardless of the driving force, the current density is found to be greatest at the conductor's surface, with a reduced magnitude deeper in the conductor. That decline in current density is known as the skin effect and the skin depth is a measure of the depth at which the current density falls to 1/e of its value near the surface. Over 98% of ...

  7. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  8. The industry hit hardest by DOGE cuts so far (hint: it's not ...

    www.aol.com/finance/industry-hit-hardest-doge...

    But the website of the firm in the middle of the contract touts just $25 million in current projects. The terms of that specific contract aren't known, but it's listed in the DOGE data as an ...

  9. Electrochemical coloring of metals - Wikipedia

    en.wikipedia.org/wiki/Electrochemical_coloring...

    Black nickel plating was developed around 1905, and between the two wars, black chrome plating (first German patent 1929.GP 607, 420), which saw wider use only from the mid-1950s. [14] After the First World War, the first procedures for anodic oxidation and coloring of anodically oxidized aluminium were developed (1923, 1924.DRP. 413876).

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