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Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.
Micromachining, semiconductor processing, microelectronic fabrication, semiconductor fabrication, MEMS fabrication and integrated circuit technology are terms used instead of microfabrication, but microfabrication is the broad general term.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
class 10, class 100, etc. – a measure of the air quality in a cleanroom; class 10 means fewer than 10 airborne particles of size 0.5 μm or larger are permitted per cubic foot of air; cleanroom (clean room) – a specialized manufacturing environment that maintains extremely low levels of particulates; CMP – see chemical-mechanical polishing
To increase yield, FOUPs and semiconductor capital equipment may have a mini environment with ISO class 1 level of dust, and FOUPs can have an even cleaner micro environment. [11] [8] FOUPs and SMIF pods isolate the wafers from the air in the cleanroom, increasing yield because they reduce the number of defects caused by dust particles. Also ...
Materials demand is driven by substrates, making up over 70 percent of the market, packaging coatings and increasing use of chemical mechanical planarization (CMP). While MEMS manufacturing continues to be dominated by used semiconductor equipment, there is a migration to 200mm lines and select new tools, including etch and bonding for certain ...
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged.