Search results
Results from the WOW.Com Content Network
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Help; Learn to edit; Community portal; Recent changes; Upload file; Special pages
Corinthian bronze (gold, silver) Cunife (nickel, iron) Cupronickel ; CuSil ; Cymbal alloys ; Devarda's alloy (aluminium, zinc) Hepatizon (gold, silver) Manganin (manganese, nickel) Melchior ; high corrosion resistance, used in marine applications in condenser tubes; Nickel silver ; Nordic gold (aluminium, zinc, tin) Shakudo
The gold is typically applied by quick immersion in a solution containing gold salts. This process is known in the industry as electroless nickel immersion gold (ENIG). A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG. [19]
Nickel is preeminently an alloy metal, and its chief use is in nickel steels and nickel cast irons, in which it typically increases the tensile strength, toughness, and elastic limit. It is widely used in many other alloys, including nickel brasses and bronzes and alloys with copper, chromium, aluminium, lead, cobalt, silver, and gold ( Inconel ...
The design of the American Buffalo gold bullion coin is a modified version of James Earle Fraser's design for the Indian Head nickel (Type 1), issued in early 1913. After a raised mound of dirt below the animal on the reverse was reduced, the Type 2 variation continued to be minted for the rest of 1913 and every year until 1938, except for 1922, 1932, and 1933 when no nickels were struck.
Group 11, by modern IUPAC numbering, [1] is a group of chemical elements in the periodic table, consisting of copper (Cu), silver (Ag), gold (Au), and roentgenium (Rg), although no chemical experiments have yet been carried out to confirm that roentgenium behaves like the heavier homologue to gold.
A barrier metal layer is used to counter this effect; these can be nickel or rhodium. Copper, which also migrates into gold, does so more slowly than silver. The copper is usually further plated with nickel. A gold-plated silver article is usually a silver substrate with layers of copper, nickel, and gold deposited on top of it.