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Modern semiconductor devices, which are designed to be assembled by reflow soldering, can usually tolerate soldering temperatures without damage. On the other hand, electrical components such as magnetic reed switches can malfunction if exposed to higher powered soldering irons, so this practice is still very much in use. [5]
An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating ...
The temperature class indicates the temperature of the wire at which it has a 20,000 hour service life. At lower temperatures the service life of the wire is longer (about a factor of two for every 10 °C lower temperature). Common temperature classes are 105 °C (221 °F), 130 °C (266 °F), 155 °C (311 °F), 180 °C (356 °F) and 220 °C ...
A silversmith hard soldering of silver rings using flux and silver solder wire. "Hard soldering" or "silver soldering" is used to join precious and semi-precious metals such as gold, silver, brass, and copper. The solder is usually described as easy, medium, or hard in reference to its melting temperature, not the strength of the joint.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Solder melts at approximately 185 °C (365 °F). Soldering irons are designed to reach a temperature range of 200 to 480 °C (392 to 896 °F). [1] Soldering irons are most often used for installation, repairs, and limited production work in electronics assembly. High-volume production lines use other soldering methods. [2]
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...
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