Search results
Results from the WOW.Com Content Network
A storey pole (or story pole, storey rod, [1] story stick, [2] jury stick, [3] scantling, [4] scantillon [5]) is a length of narrow board usually cut to the height of one storey. [6] It is used as a layout tool for any kind of repeated work in carpentry including stair-building , framing , timber framing , siding , brickwork , and setting tiles.
The Hull cell is a trapezoidal container that holds 267 milliliters of a plating bath solution. This shape allows one to place the test panel on an angle to the anode. As a result, the deposit is plated at a range current densities along its length, which can be measured with a Hull cell ruler.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
[1] The plating bath also often includes: complexing agents, such as carboxylic acids or amines to increase phosphate solubility and to prevent the white-out phenomena by slowing the reaction. stabilizers, such as lead salts, sulfur compounds, or various organic compounds, to slow the reduction by co-depositing with the nickel.
A sulfate-based bath that uses insoluble catalytic anodes, which maintains an electrode potential that prevents oxidation. The trivalent chromium-plating process can plate the workpieces at a similar temperature, rate and hardness, as compared to hexavalent chromium. Plating thickness ranges from 5 to 50 μin (0.13 to 1.27 μm). [2]
High zinc improves the bath's efficiency (plating speed), while lower levels improve the bath's ability to throw into low current densities. Typically, the Zn metal level varies between 20 and 50 g/L (2.7-6.7 oz/gal). The pH varies between 4.8 and 5.8 units. The following chart illustrates a typical all potassium chloride bath composition:
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The formula was meant to be dissolved in water at the concentration of 9.0 g/L, giving a bath with pH = 1.5. It yielded a light gold color after 1 min, and a golden-brown film after 3 min. The average thickness ranged between 200 and 1000 nm. [6] Iridite 14-2 is a chromate conversion bath for aluminum.