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Kulicke & Soffa Reports Third Quarter 2013 Results SINGAPORE--(BUSINESS WIRE)-- Kulicke and Soffa Industries, Inc. (NAS: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") today announced Kulicke ...
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common.
Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold - gold (Au) , are brought into atomic contact applying force and heat simultaneously. [ 1 ]
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A rapidly increasing list of graphene production techniques have been developed to enable graphene's use in commercial applications. [1]Isolated 2D crystals cannot be grown via chemical synthesis beyond small sizes even in principle, because the rapid growth of phonon density with increasing lateral size forces 2D crystallites to bend into the third dimension. [2]
This was a precursor to the RCD, with disadvantages of covering fewer fault scenarios, and potentially not working at all in the presence of parallel earth paths (e.g. bonding of gas/water pipes). [7] Isolator switch (or isolator) Used for isolating a device from its power supply for maintenance or safety reasons.
Graphene is a transparent and flexible conductor that holds great promise for various material/device applications, including solar cells, [338] light-emitting diodes (LED), integrated photonic circuit devices, [339] [340] touch panels, and smart windows or phones. [341] Smartphone products with graphene touch screens are already on the market ...