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UniDIMM (short for Universal DIMM) is a specification for dual in-line memory modules (DIMMs), which are printed circuit boards (PCBs) designed to carry dynamic random-access memory (DRAM) chips. UniDIMMs can be populated with either DDR3 or DDR4 chips, with no support for any additional memory control logic; as a result, the computer's memory ...
A memory bank is a part of cache memory that is addressed consecutively in the total set of memory banks, i.e., when data item a(n) is stored in bank b, data item a(n + 1) is stored in bank b + 1. Cache memory is divided in banks to evade the effects of the bank cycle time (see above) [=> missing "bank cycle" definition, above]. When data is ...
Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were ...
A science fair or engineering fair is an event hosted by a school that offers students the opportunity to experience the practices of science and engineering for themselves. In the United States, the Next Generation Science Standards makes experiencing the practices of science and engineering one of the three pillars of science education.
A science project is an educational activity for students involving experiments or construction of models in one of the science disciplines. Students may present their science project at a science fair, so they may also call it a science fair project. Science projects may be classified into four main types.
Science Buddies also provides resources to support parents and teachers as they guide students seeking out and performing science projects. They attempt to provide a bridge between scientists, engineers, educators, and students, giving students access to current scientific research and simultaneously giving scientists a way to reach out to ...
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The memory module is pressed and held in place against a bar with land grid array pin contacts which connect to the motherboard. Advantages of CAMM include lower thickness, allows for replaceable LPDDR modules, faster speeds above 6400 MT/s, higher capacities up to 128 GB per module and higher memory bandwidth.