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2. Die singulation - Wikipedia

   en.wikipedia.org/wiki/Die_singulation

   Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

3. Laser cutting - Wikipedia

   en.wikipedia.org/wiki/Laser_cutting

   Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.

4. Cricut - Wikipedia

   en.wikipedia.org/wiki/Cricut

   Cutting plotters, heat press. Number of employees. 690 [1] Website. cricut.com. Cricut, Inc. is an American brand of cutting plotters, or computer-controlled cutting machines, designed for home crafters. The machines are used for cutting paper, felt, vinyl, fabric [2] and other materials such as leather, matboard, and wood.

5. List of laser types - Wikipedia

   en.wikipedia.org/wiki/List_of_laser_types

   Nd:YAP laser (yttrium aluminium perovskite) 1.0646 μm [7] Flashlamp, laser diode. Surgery, tattoo removal, hair removal, research, pumping other lasers (combined with frequency doubling to produce a green 532 nm beam) Nd:Cr:YAG laser. 1.064 μm, (1.32 μm) solar radiation. Experimental production of nanopowders.

6. Fiber laser - Wikipedia

   en.wikipedia.org/wiki/Fiber_laser

   Fiber laser. A fiber laser (or fibre laser in Commonwealth English) is a laser in which the active gain medium is an optical fiber doped with rare-earth elements such as erbium, ytterbium, neodymium, dysprosium, praseodymium, thulium and holmium. They are related to doped fiber amplifiers, which provide light amplification without lasing.

7. Laser beam machining - Wikipedia

   en.wikipedia.org/wiki/Laser_beam_machining

   where t is the depth of cut, P is the laser beam power, v is the cutting velocity, and d is the laser beam spot diameter. [5] The depth of the cut is also influenced by the workpiece material. The material's reflectivity, density, specific heat, and melting point temperature all contribute to the lasers ability to cut the workpiece.