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  2. Polishing (metalworking) - Wikipedia

    en.wikipedia.org/wiki/Polishing_(metalworking)

    When buffing there are two types of buffing motions: the cut motion and the color motion. The cut motion is designed to give a uniform, smooth, semi-bright surface finish. This is achieved by moving the workpiece against the rotation of the buffing wheel, while using medium to hard pressure. The color motion gives a clean, bright, shiny surface ...

  3. Electropolishing - Wikipedia

    en.wikipedia.org/wiki/Electropolishing

    Can polish areas that are inaccessible by other polishing methods. Removes a small amount of material (typically 20-40 micrometre in depth in the case of stainless steel) from the surface of the parts, while also removing small burrs or high spots. It can be used to reduce the size of parts when necessary.

  4. Surface finishing - Wikipedia

    en.wikipedia.org/wiki/Surface_finishing

    A #7 finish is produced by polishing with a 280–320 grit belt or wheel and sisal buffing with a cut and color compound. This is a semi-bright finish that will still have some polishing lines but they will be very dull. Carbon steel and iron are commonly polished to a #7 finish before chrome plating.

  5. Black oxide - Wikipedia

    en.wikipedia.org/wiki/Black_oxide

    Black oxide or blackening is a conversion coating for ferrous materials, stainless steel, copper and copper based alloys, zinc, powdered metals, and silver solder. [1] It is used to add mild corrosion resistance, for appearance, and to minimize light reflection. [ 2 ]

  6. Tumble finishing - Wikipedia

    en.wikipedia.org/wiki/Tumble_finishing

    Typically, a full tumble polish from rough rock to polish takes 3–5 weeks, and is done in a minimum of 3 steps. Initially, the rocks are smoothed with a coarse grit (such as 60-90 mesh ). The idea behind the first step is to take rough rock or stone and grind it (tumble it) down into a form which is indistinguishable (in shape) from the final ...

  7. Chemical-mechanical polishing - Wikipedia

    en.wikipedia.org/wiki/Chemical-mechanical_polishing

    This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the wafer for the formation of additional circuit elements. For example, CMP can bring the entire surface within the depth of field of a photolithography system, or selectively remove material based on its position.

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  9. Polishing - Wikipedia

    en.wikipedia.org/wiki/Polishing

    Polishing is the process of creating a smooth and shiny surface by rubbing it or by applying a chemical treatment, leaving a clean surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations). [1]

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