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Core i7, on the desktop platform no longer supports hyper-threading; instead, now higher-performing core i9s will support hyper-threading on both mobile and desktop platforms. Before 2007 and post-Kaby Lake, some Intel Pentium and Intel Atom (e.g. N270, N450) processors support hyper-threading.
An iterative refresh of Raptor Lake-S desktop processors, called the 14th generation of Intel Core, was launched on October 17, 2023. [1] [2]CPUs in bold below feature ECC memory support only when paired with a motherboard based on the W680 chipset according to each respective Intel Ark product page.
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7), Core 3-, Core 5-, and Core 7-branded processors.
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
Intel Atom Oak Trail 2-way simultaneous multithreading, in-order, burst mode, 512 KB L2 cache Intel Atom Bonnell: 2008 SMT Intel Atom Silvermont: 2013 Out-of-order execution Intel Atom Goldmont: 2016 Multi-core, out-of-order execution, 3-wide superscalar pipeline, L2 cache Intel Atom Goldmont Plus: 2017 Multi-core Intel Atom Tremont: 2019
Lakefield: mobile-only, Intel's first hybrid processor, released in June 2020. Tremont is used in efficiency cores (E-cores) of Lakefield processors. [12] Jasper Lake: Celeron and Pentium Silver desktop and mobile processors, released in Q1 2021. Elkhart Lake: embedded processors targeted at IoT, released in Q1 2021. Gracemont
Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA) CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x; Package size: 37.5 mm × 37.5 mm; Steppings: B0; TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
The latest standard badge design used by Intel to promote the Celeron brand. The Celeron was a family of microprocessors from Intel targeted at the low-end consumer market. CPUs in the Celeron brand have used designs from sixth- to eighth-generation CPU microarchitectures. It was replaced by the Intel Processor brand in 2023.
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