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The decrease of temperature is based on the increase of bonding strength using plasma activation on clean wafer surfaces. Further, the increase is caused by elevation in amount of Si-OH groups, removal of contaminants on the wafer surface, the enhancement of viscous flow of the surface layer and the enhanced diffusivity of water and gas trapped at the interface. [2]
Eftilagimod alpha (lab names: IMP321 or LAG-3Ig) is a soluble dimeric recombinant form of LAG-3, being a fusion protein with immunoglobulin, designed to activate antigen presenting cells. Immutep established in 2008 that the product could induce activation of dendritic cell and monocytes, resulting in T cell expansion. [10]
Inertial electrostatic confinement, or IEC, is a class of fusion power devices that use electric fields to confine the plasma rather than the more common approach using magnetic fields found in magnetic confinement fusion (MCF) designs. Most IEC devices directly accelerate their fuel to fusion conditions, thereby avoiding energy losses seen ...
Fusion-io has unveiled a new product line. Dubbed Fusion ioScale by the flash memory maker, the products provide up to 3.2 terabytes of memory capacity that the company said in a press release are ...
Plasma activation (or plasma functionalization) is a method of surface modification employing plasma processing, which improves surface adhesion properties of many materials including metals, glass, ceramics, a broad range of polymers and textiles and even natural materials such as wood and seeds. Plasma functionalization also refers to the ...
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Lattice confinement fusion (LCF) is a type of nuclear fusion in which deuteron-saturated metals are exposed to gamma radiation or ion beams, such as in an IEC fusor, avoiding the confined high-temperature plasmas used in other methods of fusion.