Search results
Results from the WOW.Com Content Network
3D XPoint (pronounced three-D cross point) is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and was available on the open market under the brand name Optane (Intel) from April 2017 to July 2022. [ 1 ]
4-layer 3D XPoint PCIe 4.0 x4 NVMe 2.5" 15mm Intel 7200/4800 1500/1150 Q4 2020 Endurance: 100 DWPD DC P1600X Emerald Rapids 58/118 4-layer 3D XPoint PCIe 3.0 x4 NVMe M.2 Intel 1760/1050 410/243 Q2 2021 Endurance: 1292 TBW DC P5801X Alder Stream 400/800 4-layer 3D XPoint PCIe 4.0 x4 NVMe E1.S 15mm Intel 7200/4800 1480/1100 Q4 2022
IM Flash Technologies, LLC was the semiconductor company founded in January 2006, by Intel Corporation and Micron Technology, Inc. IM Flash produced 3D XPoint used in data centers and high end computers. It had a 300mm wafer fab in Lehi, Utah, United States.
The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for Quick Path Interconnect (QPI), and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to ...
Toshiba in 2007 [24] and Samsung in 2009 [25] announced the development of 3D V-NAND, a means of building a standard NAND flash bit string vertically rather than horizontally to increase the number of bits in a given area of silicon. Figure 6. Vertical NAND structure. A rough idea of the cross section of this is shown in figure 6.
Qumulo was founded in March 2012 by Neal Fachan, Peter Godman, and Aaron Passey. They all previously worked at Isilon, a storage platform that was acquired by EMC. [1] [2] Several of Qumulo's key employees are also former Isilon employees.
The company in 2013 announced its goal was a terabyte of storage on a single RRAM integrated circuit, compatible with standard CMOS semiconductor manufacturing processes, [10] with a prototype showcased the same year having the theoretical ability to achieve this on a 200mm 2 chip.
Foreshadow, known as L1 Terminal Fault (L1TF) by Intel, [1] [2] is a vulnerability that affects modern microprocessors that was first discovered by two independent teams of researchers in January 2018, but was first disclosed to the public on 14 August 2018. [18]