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A digipak or digipack (generic term) [citation needed] is a rectangular cardboard package with one or more plastic trays capable of holding a disc attached to the inside. There are variations where the disc(s) sit on a hub or spindle inside and come in various sizes.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes.
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm.
An example of how package design is affected by other factors is its relationship to logistics. When the distribution system includes individual shipments by a small parcel carrier, the sorting, handling, and mixed stacking make severe demands on the strength and protective ability of the transport package.
Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
PackML (Packaging Machine Language) is an industry technical standard for the control of packaging machines, as an aspect of industrial automation. PackML was created by the Organization for Machine Automation and Control (OMAC) in conjunction with the International Society of Automation (ISA).
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