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2. Epoxy molding compounds - Wikipedia

   en.wikipedia.org/wiki/Epoxy_Molding_Compounds

   Epoxy molding compounds (EMC) represent a category of advanced materials utilized in electronic packaging, primarily consisting of epoxy resin, phenolic compounds, ...

3. Epoxy - Wikipedia

   en.wikipedia.org/wiki/Epoxy

   Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.

4. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   The mold may be part of the finished article and may provide shielding or heat dissipating functions in addition to acting as a mold. When the mold is removed the potted assembly is described as cast. [4] As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5]

5. Sheet moulding compound - Wikipedia

   en.wikipedia.org/wiki/Sheet_moulding_compound

   Sheet moulding compound (SMC) or sheet moulding composite is a ready to mould glass-fibre reinforced polyester material primarily used in compression moulding. [1] The sheet is provided in rolls weighing up to 1000 kg. Alternatively the resin and related materials may be mixed on site when a producer wants greater control over the chemistry and ...

6. Bulk moulding compound - Wikipedia

   en.wikipedia.org/wiki/Bulk_moulding_compound

   Bulk moulding compound (BMC), bulk moulding composite, or dough moulding compound (DMC), [1] is a ready-to-mold, glass-fiber reinforced thermoset polymer material primarily used in compression moulding, as well as in injection moulding and transfer moulding. [1]

7. Bisphenol - Wikipedia

   en.wikipedia.org/wiki/Bisphenol

   The bisphenols (/ ˈ b ɪ s f ɪ n ɒ l /) are a group of industrial chemical compounds related to diphenylmethane; commonly used in the creation of plastics and epoxy resins. [1] [2] [3] Most are based on two hydroxyphenyl functional groups linked by a methylene bridge.

8. Epoxide - Wikipedia

   en.wikipedia.org/wiki/Epoxide

   A compound containing the epoxide functional group can be called an epoxy, epoxide, oxirane, and ethoxyline. Simple epoxides are often referred to as oxides. Thus, the epoxide of ethylene (C 2 H 4) is ethylene oxide (C 2 H 4 O). Many compounds have trivial names; for instance, ethylene oxide is called "oxirane".

9. Glass-filled polymer - Wikipedia

   en.wikipedia.org/wiki/Glass-filled_polymer

   Bulk moulding compound is a pre-mixed material of resin and fibres supplied for moulding. Some are thermoplastic or thermosetting, others are chemically cured and are mixed with a catalyst (polyester) or hardener (epoxy) before moulding.