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Novellus Systems Inc. was a company founded by Brad Mattson that developed, ... and serviced semiconductor equipment used in the ... physical vapor deposition (PVD ...
The company develops and manufactures equipment used in the wafer fabrication steps of creating a semiconductor device, including atomic layer deposition (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), rapid thermal processing (RTP), chemical mechanical polishing (CMP), etch, ion implantation and wafer inspection. [32]
Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...
NAURA Technology Group (Naura; Chinese: 北方华创科技集团; pinyin: Běifāng Huáchuàng Kējì Jítuán) is a partially state-owned publicly listed Chinese company that manufactures semiconductor chip production equipment. It is currently the largest semiconductor equipment manufacturer in China. [2]
Veeco Instruments Inc. is a global capital equipment supplier, headquartered in the U.S., that designs and builds processing systems used in semiconductor and compound semiconductor manufacturing, data storage and scientific markets for applications such as advanced packaging, photonics, power electronics and display technologies.
A number of companies provide secondary semiconductor equipment and/or refurbish semiconductor tools. For example, RED Equipment ($50M+ sales in 2011) provides secondary semiconductor equipment, parts and services including equipment remarketing, de-installation, relocation, refurbishment, and installation.
Japan may not currently have a company that dominates chipmaking globally the way TSMC does for Taiwan or Samsung for South Korea, but the country does have a long history in the semiconductor space.
The PVD process can be carried out at lower deposition temperatures and without corrosive products, but deposition rates are typically lower. Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm / min at relatively low substrate temperatures, with very high material utilization efficiency.
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