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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  3. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Heat sinks function by efficiently transferring thermal energy ("heat") from an object at high temperature to a second object at a lower temperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the first object into thermal equilibrium with the second, lowering the temperature of the first object ...

  4. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...

  5. Computer fan - Wikipedia

    en.wikipedia.org/wiki/Computer_fan

    Fans attached to components are usually used in combination with a heat sink to increase the area of heated surface in contact with the air, thereby improving the efficiency of cooling. Fan control is not always an automatic process. A computer's BIOS can control the speed of the built-in fan system for the computer. A user can even supplement ...

  6. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  7. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:

  8. Super Micro Computer stock sinks 14% to erase year-to-date ...

    www.aol.com/finance/super-micro-computer-stock...

    Super Micro Computer stock cratered more than 14% Thursday to erase all of its year-to-date gains after a filing earlier this week revealed that accounting firm Ernst & Young resigned during the ...

  9. Fin (extended surface) - Wikipedia

    en.wikipedia.org/wiki/Fin_(extended_surface)

    One-piece finned heat sinks are produced by extrusion, casting, ... perimeter, and temperature can all be functions of x. ... computer CPU heatsinks, ...

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