Ads
related to: best thermal tape for heatsink windows 7 64-bit iso download free full
Search results
Results from the WOW.Com Content Network
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Very high thermal conductivity measurements up to 22,600 w m −1 K −1 were reported by Fenton, E.W., Rogers, J.S. and Woods, S.D. in reference 570 on page 1458, 41, 2026–33, 1963. The data is listed on pages 6 through 8 and graphed on page 1 where Fenton and company are on curves 63 and 64.
This cools the heat sink and whatever it is in direct thermal contact with. Use of fluids (for example coolants in refrigeration) and thermal interface material (in cooling electronic devices) ensures good transfer of thermal energy to the heat sink. Similarly, a fan may improve the transfer of thermal energy from the heat sink to the air.
In physics, thermal contact conductance is the study of heat conduction between solid or liquid bodies in thermal contact. The thermal contact conductance coefficient , h c {\displaystyle h_{c}} , is a property indicating the thermal conductivity , or ability to conduct heat , between two bodies in contact.
The first heat-shrinkable sleeves were introduced [when?] as polyethylene pipeline coatings started to replace bituminous or tape coatings in the oil and gas industry. At the time, the processing for polyethylene to make the sleeve backing was new technology and the adhesives used in sleeves were much the same as those used on pipeline coating.
Ads
related to: best thermal tape for heatsink windows 7 64-bit iso download free full