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  2. Vacuum deposition - Wikipedia

    en.wikipedia.org/wiki/Vacuum_deposition

    Aluminising vacuum chamber at Mont Mégantic Observatory used for re-coating telescope mirrors. [1] Vacuum deposition is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can ...

  3. Deposition (phase transition) - Wikipedia

    en.wikipedia.org/wiki/Deposition_(phase_transition)

    One example of deposition is the process by which, in sub-freezing air, water vapour changes directly to ice without first becoming a liquid. This is how frost and hoar frost form on the ground or other surfaces, including leaves. For deposition to occur, thermal energy must be removed from a gas.

  4. Evaporation (deposition) - Wikipedia

    en.wikipedia.org/wiki/Evaporation_(deposition)

    Evaporation takes place in a vacuum, i.e. vapors other than the source material are almost entirely removed before the process begins. In high vacuum (with a long mean free path), evaporated particles can travel directly to the deposition target without colliding with the background gas. (By contrast, in the boiling pot example, the water vapor ...

  5. Physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Physical_vapor_deposition

    Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...

  6. Vapor–liquid–solid method - Wikipedia

    en.wikipedia.org/wiki/Vapor–liquid–solid_method

    The VLS process takes place as follows: A thin (~1–10 nm) Au film is deposited onto a silicon (Si) wafer substrate by sputter deposition or thermal evaporation. The wafer is annealed at temperatures higher than the Au-Si eutectic point, creating Au-Si alloy droplets on the wafer surface (the thicker the Au film, the larger the droplets).

  7. Chemical vapor infiltration - Wikipedia

    en.wikipedia.org/wiki/Chemical_vapor_infiltration

    However, the processing time is typically very long and the deposition rate is slow, so new routes have been invented to develop more rapid infiltration techniques: Thermal-gradient CVI with forced flow – In this process, a forced flow of gases and matrix material is used to achieve less porous and more uniformly dense material.

  8. Epitaxy - Wikipedia

    en.wikipedia.org/wiki/Epitaxy

    In this method, a source material is heated to produce an evaporated beam of particles, which travel through a very high vacuum (10 −8 Pa; practically free space) to the substrate and start epitaxial growth. [14] [15] Chemical beam epitaxy, on the other hand, is an ultra-high vacuum process that uses gas phase precursors to generate the ...

  9. Vacuum engineering - Wikipedia

    en.wikipedia.org/wiki/Vacuum_engineering

    Vacuum engineering is the field of engineering that deals with the practical use of vacuum in industrial and scientific applications. Vacuum may improve the productivity and performance of processes otherwise carried out at normal air pressure, or may make possible processes that could not be done in the presence of air.