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Ti-6Al-2Sn-4Zr-2Mo (UNS designation R54620), also known as Ti 6-2-4-2, is a near alpha titanium alloy known for its high strength and excellent corrosion resistance. It is often used in the aerospace industry for creating high-temperature jet engines and the automotive industry to create high performance automotive valves.
A billet is a length of metal that has a round or square cross-section, with an area less than 36 in 2 (230 cm 2). Billets are created directly via continuous casting or extrusion or indirectly via hot rolling an ingot or bloom. [1] [2] [4] Billets are further processed via profile rolling and drawing. Final products include bar stock and wire. [3]
Titanium Beta C refers to Ti Beta-C, a trademark for an alloy of titanium originally filed by RTI International. [1] It is a metastable "beta alloy" which was originally developed in the 1960s; Ti-3Al-8V-6Cr-4Mo-4Zr, nominally 3% aluminum , 8% vanadium , 6% chromium , 4% molybdenum , 4% zirconium and balance (75%): titanium .
[2] [3] A 1948 graduate of MIT, Stanley Abkowitz (1927-2017) was a pioneer in the titanium industry and is credited for the invention of the Ti-6Al-4V during his time at the US Army’s Watertown Arsenal Laboratory in the early 1950s. [4] Titanium/Aluminum/Vanadium alloy was hailed as a major breakthrough with strategic military significance.
The +4 oxidation state dominates titanium chemistry, [1] but compounds in the +3 oxidation state are also numerous. [2] Commonly, titanium adopts an octahedral coordination geometry in its complexes, [3] [4] but tetrahedral TiCl 4 is a notable exception. Because of its high oxidation state, titanium(IV) compounds exhibit a high degree of ...
TiB 2 does not occur naturally in the earth. Titanium diboride powder can be prepared by a variety of high-temperature methods, such as the direct reactions of titanium or its oxides/hydrides, with elemental boron over 1000 °C, carbothermal reduction by thermite reaction of titanium oxide and boron oxide, or hydrogen reduction of boron halides in the presence of the metal or its halides.
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Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC 's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology , in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct ...