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A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Although the pin-fin has 194 cm 2 surface area while the straight-fin has 58 cm 2, the temperature difference between the heat-sink base and the ambient air for the pin fin is 50 °C, but for the straight-fin it was 44 °C, or 6 °C better than the pin fin. Pin fin heat sink performance is significantly better than straight fins when used in ...
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
More recently, in order to manage CPU power dissipation, processor makers favor multi-core chip designs, thus software needs to be written in a multi-threaded or multi-process manner to take full advantage of such hardware. Many multi-threaded development paradigms introduce overhead, and will not see a linear increase in speed when compared to ...
As the sensor is located directly on the processor die, it provides most local and relevant CPU and GPU temperature readings. The silicon diodes have temperature dependency of -2mV per degree Celsius. Thus the junction temperature can be determined by passing a set current through the diode and then measuring voltage developed across it.
Different software is used by different motherboards. There are also third-party programs that work on a variety of motherboards and allow wide customization of fan behavior depending on temperature readings from the motherboard, CPU, and GPU sensors, as well as allowing manual control. Two such programs are SpeedFan [11] and Argus Monitor. [12]
A modern consumer CPU made by Intel: An Intel Core i9-14900KF Inside a central processing unit: The integrated circuit of Intel's Xeon 3060, first manufactured in 2006. A central processing unit (CPU), also called a central processor, main processor, or just processor, is the most important processor in a given computer.