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Laurell Technologies WS-400 spin coater used to apply photoresist to the surface of a silicon wafer. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
A schematic of a typical slot-die coating system. Slot-die coating equipment is available in a variety of configurations and form factors. However, the vast majority of slot-die processes are driven by a similar set of common core components. These include: A fluid reservoir to store the main supply of coating fluid for the system
The bilayers and wash steps can be performed in many different ways including dip coating, spin-coating, spray-coating, flow based techniques and electro-magnetic techniques. [1] The preparation method distinctly impacts the properties of the resultant films, allowing various applications to be realized. [ 1 ]
Schematic bonding process [3] The standard process (compare to figure "Schematic bonding process") consists of applying SU-8 on the top wafer by spin-on or spray-on of thin layers (3 to 100 μm). Subsequently, the structuring of the photo-resist using direct UV light exposure is applied but can also be achieved through deep reactive-ion-etching ...
There are four basic parameters that are involved in spin coating: solution viscosity, solid content (density), angular speed, and spin time. [13] A range of thicknesses can be achieved by spin coating. Most commonly the thicknesses range from 1-200 μm. The main properties that affect the thickness of the film are viscosity and spin speed.
Sputter coating in scanning electron microscopy is a sputter deposition process [clarification needed] to cover a specimen with a thin layer of conducting material, typically a metal, such as a gold/palladium (Au/Pd) alloy. A conductive coating is needed to prevent charging of a specimen with an electron beam in conventional SEM mode (high ...
Schematic representation of the different stages and routes of the sol–gel technology. In this chemical procedure, a "sol" (a colloidal solution) is formed that then gradually evolves towards the formation of a gel-like diphasic system containing both a liquid phase and solid phase whose morphologies range from discrete particles to continuous polymer networks.
The wafer is covered with photoresist liquid by spin coating. Thus, the top layer of resist is quickly ejected from the wafer's edge while the bottom layer still creeps slowly radially along the wafer. In this way, any 'bump' or 'ridge' of resist is removed, leaving a very flat layer.