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  2. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    Solder (UK: / ˈ s ɒ l d ə, ˈ s ə ʊ l d ə /; [1] NA: / ˈ s ɒ d ər /) [2] is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling.

  3. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

  4. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    The solder used in the process can vary in composition, with different alloys used for different applications. Common solder alloys include tin-lead, tin-silver, and tin-copper, among others. Lead-free solder has also become more widely used in recent years due to health and environmental concerns associated with the use of lead.

  5. Stencil printing - Wikipedia

    en.wikipedia.org/wiki/Stencil_Printing

    Ideally, a solder paste should have, at minimum, a 4-hour stencil life. The stencil life is defined as a time period in which there will be no significant change in the solder paste material characteristics. A solder paste with a longer stencil life will be more robust in the printing process.

  6. Solder form - Wikipedia

    en.wikipedia.org/wiki/Solder_form

    In the language of principal bundles, a solder form on a smooth principal G-bundle P over a smooth manifold M is a horizontal and G-equivariant differential 1-form on P with values in a linear representation V of G such that the associated bundle map from the tangent bundle TM to the associated bundle P× G V is a bundle isomorphism.

  7. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

  8. Ball grid array - Wikipedia

    en.wikipedia.org/wiki/Ball_grid_array

    BGA ICs assembled on a Memory module. The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed.

  9. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...