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Chemical Bath Deposition has a long history but until recently was an uncommon method of thin-film deposition. [1]In 1865, Justus Liebig published an article describing the use of Chemical Bath Deposition to silver mirrors (to affix a reflective layer of silver to the back of glass to form a mirror), [5] though in the modern day electroplating and vacuum deposition are more common.
At temperatures below the coalescence temperature, film growth behavior and rupturing behavior is quite different from the usual practice as a result of porous deposition. The coating time also is an important variable in determining the film thickness, the quality of the deposited film, and the throwpower.
Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current.
This reaction characterized by reversible and fast electrode kinetics, [3] meaning that a sufficiently high current can be passed through the electrode with the 100% efficiency of the redox reaction (dissolution of the metal or cathodic deposition of the copper-ions).
Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...
The part to be coated is immersed in a bath of electrolyte which usually consists of a dilute alkaline solution such as KOH. It is electrically connected, so as to become one of the electrodes in the electrochemical cell, with the other "counter-electrode" typically being made from an inert material such as stainless steel, and often consisting of the wall of the bath itself.
Mass of the electrode can be increased during cathodic deposition of the mercury ions or decreased during the anodic dissolution of the metal. Q = 2 Δ m F M Hg , {\displaystyle Q={\frac {2\,\Delta m\,F}{M_{{\ce {Hg}}}}},} where Q is the quantity of electricity; Δ m are the mass changes; F is the Faraday constant ; and M Hg is the molar mass ...
It can be used for electrochemical deposition of thin films or for determining suitable reduction potential range of the ions present in electrolyte for electrochemical deposition. [13] CV can also be used to determine the electron stoichiometry of a system, the diffusion coefficient of an analyte, and the formal reduction potential of an ...