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Sintering die attach; IC encapsulation Baking; Plating; Lasermarking; Trim and form; Wafer bonding; Sintering die attach is a process that involves placing the semiconductor die onto the substrate and then subjecting it to high temperature and pressure in a controlled environment. [18]
The PCB of a quartz watch. The clock IC is under the drop of black epoxy. Chip on board (COB) is a method of circuit board manufacturing in which integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. [1]
Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ...
In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive agents, to increase resistance to shocks and vibrations, or to prevent gaseous phenomena such as corona discharge in high-voltage assemblies.
The standard process (compare to figure "Schematic bonding process") consists of applying SU-8 on the top wafer by spin-on or spray-on of thin layers (3 to 100 μm). Subsequently, the structuring of the photo-resist using direct UV light exposure is applied but can also be achieved through deep reactive-ion etching (DRIE) .
Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier. This FPC with the die(s) (TAB inner lead bonding, ILB) can be mounted on the system ...
To attach the flip chip into a circuit, the chip is inverted to bring the solder dots down onto connectors or pads on the underlying electronics or circuit board or substrate. The solder is then re-melted to produce an electrical connection, typically using a thermosonic bonding or alternatively reflow solder process.
Eutectic bonding is able to produce hermetically sealed packages and electrical interconnection within a single process (compare ultrasonic images). [ further explanation needed ] This procedure is conducted at low temperatures, which results in low resultant stress induced in final assembly, high bonding strength, large fabrication yield and a ...
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