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A via, sometimes called PTV or plated-through-via, should not be confused with a plated through hole (PTH). A via is used as an interconnection between copper layers on a PCB while the PTH is generally made larger than vias and is used as a plated hole for acceptance of component leads - such as non-SMT resistors, capacitors, and DIP package IC.
The HDI layers are usually built up from a traditionally manufactured double-sided core board or multilayer PCB. The HDI layers are built on both sides of the traditional PCB one by one with microvias. The SBU process consists of several steps: layer lamination, via formation, via metallization, and via filling.
Samples may first be cut down in size, for example, around a via in a PWB or around a ceramic capacitor soldered to a PWB. Samples may be prepared by encapsulation in a rigid material such as epoxy to keep the sample intact during grinding and with a vacuum step to fill in air gaps and create a solid sample with no voids. However, cross ...
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
A via fence consists of a row of via holes, that is, holes that pass through the substrate and are metallised on the inside to connect to pads on the top and bottom of the substrate. In a stripline format both the top and bottom of the dielectric sheet are covered with a metal ground plane so any via holes are automatically grounded at both ends.
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Copper pour is sometimes filled using a hatch fill style. In electronics, the term copper pour refers to an area on a printed circuit board filled with copper (the metal used to make connections in printed circuit boards). Copper pour is commonly used to create a ground plane.