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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins than can be put on a dual in-line or flat package .
Also known as laminate ball-grid array [3] TEPBGA: Thermally-enhanced plastic ball-grid array: CBGA: Ceramic ball-grid array [3] OBGA: Organic ball-grid array [3] TFBGA: Thin fine-pitch ball-grid array [3] PBGA: Plastic ball-grid array [3] MAP-BGA: Mold array process - ball-grid array : UCSP: Micro (μ) chip-scale package: Similar to a BGA (A ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8] Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types.
Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory.Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and server computers. Because they allow easy swapping of components, they are also used for prototyping new circuits.
The substrate can have a Ball Grid Array (BGA) on its underside. The substrate makes the connections to the die available for use by the PCB. [ 11 ] Substates made with build up film such as Ajinomoto Build up Film (ABF), are manufactured around a core, and the film is stacked on the core in layers by vacuum lamination at high temperatures.
An example is ball grid array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste. Other platings used are organic solderability preservative (OSP), immersion silver (IAg), immersion tin (ISn), electroless nickel immersion gold (ENIG) coating, electroless nickel electroless ...
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